From 4th to 7th September 2017, the 6th DEXPI Hackathon has taken place at the offices of SIEMENS in Cologne, Germany. A fantastic team of several companies (AixCAPE, Autodesk, Aveva, Evonik, Intergraph, Hexagon, PTC, Siemens, VTT Finland) had a great time hacking, chatting, thinking, drinking coffee and bringing the DEXPI initiative forward. Main topics have […]
On 11th of July 2017, the members of the DEXPI initative met in Franfurt for another organizational meeting. Beside two new members, several interesting topics have been discussed.
In May 2017, the the DEXPI initiative met for another organizational meeting. This time, responsible persons from ISO and PCA joined the meeting to foster international cooperation of DEXPI. Several interesting topics have been discussed.
On 28th of March, the DEXPI initiative came together for another successful meeting. Several main topics have been discussed to push the DEXPI initiative forward.
The 5th hackathon at the office of Intergraph in Ismaning on 14-16 March 2017 was a great success. 16 persons from 9 companies attended.
February 2017 has been a forward-looking and trendsetting month for the DEXPI initiative. On Wednesday, the 22nd, thirty managers of BASF, Bayer, Evonik, Air Liquide, Autodesk, Siemens, Intergraph, Aveva, X-Visual, eVision, TU-Berlin and AixCAPE came together to discuss the current status of the DEXPI initiative and define the roadmap for the future.
The latest DEXPI meeting in Frankfurt at the DECHEMA has been a great success. The DEXPI group has discussed the new Equipment Data Model which will be published in the next version of the DEXPI specification. We have prepared the next presentation at the FIATECH Showcase & Conference, 12. April 2017 in Orlando, Florida, USA. The next DEXPI-Hackathon […]
The 4th hackathon at the offices of Autodesk in Munich was a great success. All software vendors got together and have been developing their import and export functionality. Topics of the hackathon
The DEXPI group has had a very successful team-meeting in Frankfurt, Germany. A proposal for the full scope of equipment modeling has been presented for alignment.